OEMs and jobshops are well aware of the financial and manufacturing efficiency benefits of combining individual parts into integrated assemblies whenever possible. Lower costs and easier to control specifications for outsourcing are just two of the advantages available.
Electrical Assemblies: The build-to-print electrical assembly approach is an important process applied to the manufacture of the wide range of components that rely on electricity. The challenge for the assembler is to conform to the customer's price, delivery and field reliability expectations. Examples of products assembled by this technique include motor starters, solenoids, indicator lights, switches, barrier strips, wire terminations, cabinet and rack wiring, cable harnesses, wire wrap, custom cables and PCBs. Applicable to virtually every industry, including aerospace, defense, telecommunications, electronic and electro-mechanical.
Electromechanical Assemblies: The build-to-print electromechanical assembly approach is an important process applied to the manufacture of complex and high-value products for scientific instruments and capital equipment. The challenge for the assembler is to conform to the customer's price, delivery and field reliability expectations. An example of a product assembled by this technique is an industrial process control device. Hundreds of discrete items comprise such a device. They can include formed sheet metal components, machined parts, circuit breakers, motor starters, solid-state relays, solenoids, indicator lights, switches, barrier strips, wire terminations, labels, and fasteners.
Electronic Assemblies: Speedier transmission of information is the ultimate payoff as microelectronic devices continue to get smaller and smaller. Today, contract electronics manufacturers have the technology and skills to make it happen. Adding momentum to the move toward smaller circuitry are technologies such as ball grid arrays, flip chips, and chip-scale packages, all of which permit faster transmission of information through greater board densities. At the same time, numerous pressures are causing many OEMs to seek the expertise of outside sources.
